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Copper Plating Additives
Created with Pixso. Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process

Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process

Brand Name: AOBANG
Model Number: 2000
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Copper Sulfate Pentahydrate:
195-255 G/L
Pure Sulfuric Acid:
27-38 ML/L
Chloride Ion:
80-150 Mg/L
Operating Temperature:
20-30 ℃
Cathode Current Density:
1-6 A/dm²
Anode Current Density:
0.5-2.5 A/dm²
Packaging Details:
25kg/drum
Highlight:

Dye System Copper Plating Additives

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Acid Copper Plating Additives

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Dye Based Acid Copper Plating Process

Product Description

RUBIN F 2000 Dye-Based Acid Copper Process

Performance & Features

  1. Dye-system acid copper plating additive.
  2. Low internal stress and excellent ductility of deposits.
  3. Wide temperature tolerance, stable operation above 30 ℃.
  4. Outstanding leveling and throwing power.

Operating Parameters

Item Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O) 195–255 g/L
Pure Sulfuric Acid (SG=1.84 g/mL) 27–38 mL/L
Chloride Ion (Cl⁻) 80–150 mg/L
2000 Make-Up Agent 8–10 mL/L
2000 A Leveler 0.4–0.6 mL/L
2000 B Brightener 0.3–0.6 mL/L
Operating Temperature 20–30 ℃
Cathode Current Density 1–6 A/dm²
Anode Current Density 0.5–2.5 A/dm²
Anode Material Phosphor copper balls (0.03–0.06% P)
Operating Voltage 1.0–6.0 V
Agitation Air agitation + mechanical agitation