Good price  online

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Copper Plating Additives
Created with Pixso. High Speed Acid Copper Plating Process Compatible With Iron Parts Zinc Alloy Plastic Plating

High Speed Acid Copper Plating Process Compatible With Iron Parts Zinc Alloy Plastic Plating

Model Number: R·G-OUTRE
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Features:
Ultra-Fast Deposition, Wide Compatibility
Product Code:
R·G-OUTRE
Type:
High-Speed Acid Copper Process
Copper Sulfate:
200-220 G/L
Operating Temperature:
20-30 ℃
Cathode Current Density:
1-6 A/dm²
Packaging Details:
25kg/drum
Highlight:

High Speed Copper Plating Process

,

Acid Copper Plating Process

Product Description
R·G-OUTRE High-Speed Acid Copper Plating Process
Performance & Features

Combines the advantages of Cupracid 210 and Cupracid 300; easy bath control and excellent leveling performance.

  1. Minimal pinholes, low internal stress and good ductility of deposits.
  2. Wide current density window; leveling capacity up to 75% to achieve full bright finish.
  3. Ultra-fast deposition rate: approx. 1 μm copper per minute at 4.5 A/dm², shortening plating cycle.
  4. Low coating resistivity, ideal for motor industry with strict requirements on physical properties.
  5. Compatible with various substrates: iron parts, zinc alloy, plastic plating and more.
  6. High impurity loading capacity; activated carbon treatment only required after approx. 800–1000 Ah/L bath usage.
Operating Parameters
Item Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O) 200–220 g/L
Sulfuric Acid (Specific gravity=1.84) 50–90 g/L
Chloride Ion 70–150 mg/L (ppm)
Outre Make-Up Agent 4–8 mL/L
Outre A Brightener 0.4–0.6 mL/L
Outre B Brightener 0.4–0.6 mL/L
Operating Temperature 20–30 ℃
Cathode Current Density 1–6 A/dm²
Anode Current Density 0.5–2.5 A/dm²
Anode Material Phosphor copper balls (0.03% P)
Agitation Air agitation + mechanical agitation