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Copper Plating Additives
Created with Pixso. Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

Brand Name: AOBANG
Model Number: R·G-910
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Leveling Power:
95%
Copper Sulfate Pentahydrate:
160-210 G/L
Pure Sulfuric Acid:
50-70 G/L
Chloride Ion:
60-120 Mg/L (ppm)
Operating Temperature:
20-30 ℃
Cathode Current Density:
1-8 A/dm²
Packaging Details:
25kg/drum
Highlight:

High Leveling Copper Plating Additives

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Stable Copper Plating Additives

Product Description
R·G-910 High Leveling Acid Copper Plating Additive
Performance & Features
  1. Innovative ultra-high concentrated composite formula with leveling power up to 95%.
  2. Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility.
  3. Extremely stable plating solution, crystal clear bright surface without fogging.
  4. High impurity tolerance and long bath service life.
Operating Parameters
Item Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O) 160–210 g/L
Pure Sulfuric Acid (Specific gravity=1.84) 50–70 g/L
Chloride Ion 60–120 mg/L (ppm)
R·G-910 MU Make-up Agent 4–10 mL/L
R·G-910 A Primary Brightener 0.4–0.8 mL/L
R·G-910 B Primary Brightener 0.3–0.5 mL/L
Operating Temperature 20–30 ℃
Cathode Current Density 1–8 A/dm²
Anode Current Density 0.5–3.0 A/dm²
Anode Material Phosphor copper balls (0.03–0.06% P)
Agitation Air agitation or mechanical agitation