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Copper Plating Additives
Created with Pixso. High Speed High Current Acid Copper Plating Additives With Excellent Leveling Capacity

High Speed High Current Acid Copper Plating Additives With Excellent Leveling Capacity

Brand Name: AOBANG
Model Number: R·G-FPEP 310
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Copper Sulfate:
80-300 G/L
Sulfuric Acid:
45-120 G/L
Chloride Ion:
60-120 Mg/L (ppm)
Operating Temperature:
30-60 ℃
Cathode Current Density:
20-50 A/dm²
Anode Current Density:
2-6 A/dm²
Packaging Details:
25kg/drum
Highlight:

High Speed Copper Plating Additives

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High Current Copper Plating Additives

Product Description
R·G-FPEP310 High-Speed High-Current Acid Copper Plating Process
Performance & Features

FPEP 310 is a mature high-speed acid copper plating technology designed for ultra-high current density operation.

Deposits produced by FPEP 310 are bright, highly ductile and feature excellent leveling capacity, which conceals most substrate defects, scratches and polishing marks.

Operating Parameters
Item Working Range
FPEP 310-A 3–5 mL/L
FPEP 310-N 0.2–0.4 mL/L
Copper Sulfate 80–300 g/L
Sulfuric Acid 45–120 g/L
Chloride Ion 60–120 mg/L (ppm)
Operating Temperature 30–60 ℃
Agitation Vigorous and uniform air agitation
Filtration Continuous filtration; tank cleaning twice per hour
Cathode Current Density 20–50 A/dm²
Anode Current Density 2–6 A/dm²
Rack Material PVC plastisol, stainless steel hooks
Anode Phosphor copper anodes (0.03–0.05% P), packed in polypropylene anode bags