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Copper Plating Additives
Created with Pixso. DS-33 Acid Copper Plating Additives Low Internal Stress High Ductility

DS-33 Acid Copper Plating Additives Low Internal Stress High Ductility

Model Number: DS-33
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Features:
Low Internal Stress, Outstanding Ductility
Product Code:
DS-33
Type:
Acid Copper Additive
Operating Temperature:
20-45 ℃
Cathode Current Density:
1-6 A/dm²
Anode Material:
Phosphor Copper
Packaging Details:
25kg/drum
Highlight:

Copper Plating Additives Low Internal Stress

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Copper Plating Additives High Ductility

Product Description
DS-33 Acid Copper Plating Additive
Performance & Features
  1. Excellent leveling performance across a wide range from high-current to low-current density areas.
  2. Low internal stress and outstanding ductility of deposits.
  3. Superior brightness and covering power especially in low-current regions.
  4. Excellent heat resistance.
  5. Produces bright, clear and attractive coating appearance.
  6. Main bath components can be analyzed accurately for precise bath maintenance.
Operating Parameters
Item Working Range
Cathode Current Density 1–6 A/dm²
Anode Current Density 1–3 A/dm² (Optimal: 3–9 A/dm²)
Bath Temperature 20–45 ℃
Agitation Vigorous air agitation
Filtration Continuous filtration without activated carbon
Anode Material Phosphor copper anode