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Copper Plating Additives
Created with Pixso. DS-111 Pyrophosphate Copper Pre Plating Process High Current Efficiency

DS-111 Pyrophosphate Copper Pre Plating Process High Current Efficiency

Model Number: DS-111
MOQ: 25-30kg
Delivery Time: 5-8 work day
Payment Terms: T/T
Detail Information
Place of Origin:
China
Features:
Strong Adhesion, Eco-Friendly
Product Code:
DS-111
Type:
Pyrophosphate Copper Pre-Plating
PH Value:
10-11
Operating Temperature:
40-60 ℃
Anode Material:
Electrolytic Copper Plate
Packaging Details:
25kg/drum
Highlight:

Copper Pre Plating Process

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Pyrophosphate Copper Plating Process

Product Description

DS-111 Pyrophosphate Copper Pre-Plating Process

Performance & Features

The coating boasts strong adhesion to substrates. It can be used for direct plating or strike plating on steel, and delivers excellent coatings on aluminum alloy and zinc alloy.
  1. Serves as an underlayer for acid copper, nickel, tin, silver and gold plating.
  2. Outstanding comprehensive performance including superior throwing power, high current efficiency, pore-free and compact deposits.
  3. Simple bath composition, easy maintenance and stable solution.
  4. Eco-friendly, safe operation and simple wastewater treatment.
  5. Compatible with cyanide alkaline copper baths for direct tank conversion.

Operating Parameters

Item Working Range (Rack Plating)
Copper Pyrophosphate 20–40 g/L
DS111 Complexing Agent 160–200 g/L
Potassium Sodium Tartrate 25–30 g/L
Alkaline Copper Brightener 4–6 mL/L
Operating Temperature 40–60 ℃
pH Value 10–11
Anode Material Electrolytic copper plate
Agitation Air agitation + circulation filtration